PACK EXPO International 2026

Written By Gephyro Consulting

FUJISEIKI will participate in the PACK EXPO International 2026 and present processing and packaging-related solutions.

<PACK EXPO International 2026>
Date: Oct 18-21, 2026
Venue: McCormick Place Chicago, IL
Website: https://www.packexpointernational.com/

Contact us for inquiries
Contact us for inquiries
Gephyro Consulting
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